The fully integrated 3D snapshot sensor for maximum efficiency

The new surfaceCONTROL 3D 3560 combines high-precision 3D measurement, processing and evaluation directly in the sensor.

With the surfaceCONTROL 3D 3560, Micro-Epsilon offers a new generation of powerful 3D snapshot sensors for automated quality inspection. As an all-in-one solution, the sensor combines acquisition, processing and evaluation in a single device. High-resolution 3D data is processed directly in the sensor, and the determined measured values or evaluated results are output directly to the controller. This reduces system complexity, integration effort and the volume of data to be transmitted. At the same time, the integrated controller enables significantly faster processing and shortens the measurement time severalfold.
With a single acquisition, the surfaceCONTROL 3D 3560 captures complete 3D data of the target. Thanks to a Z-axis repeatability of up to 0.25 µm and a lateral resolution of up to 8 µm, even the smallest structures and height differences are reliably detected. The resulting dense 3D point cloud enables precise evaluation of shape, geometry and surface characteristics. Four different measuring fields provide additional flexibility for a wide variety of component sizes and measurement tasks.
A key advantage is the integrated evaluation. The measurement data does not first have to be transferred to an external computer, but can be evaluated directly in the sensor in terms of shape, geometry, surface or quality. Only the required measured values or already evaluated results are then transferred to the PLC or higher-level system. Interfaces such as PROFINET, EtherCAT, EtherNet/IP, Modbus TCP and UDP are available for integration into automation environments. Alternatively, the 3D data can be integrated into compatible image processing systems via GenICam and GigE Vision.
The surfaceCONTROL 3D 3560 is suitable for numerous applications in industrial quality assurance, for example for inspecting the coplanarity of assembled printed circuit boards, inline inspection of thermal interface pastes or high-resolution 3D inspection of smartphone components.